Ersa Rework

Guided Rework System Ersa HR 550 XL

Guided Rework System HR 550 XL

Large and flexible: guided rework for large boards up to 530 x 610 mm

Article-No.: 0HR550XL

With the Rework System HR 550 XL, Ersa presents a semi-automatic unit for large assemblies up to approx. 530 x 610 mm - a real performance package with eight bottom radiator heating zones and motorized X/Y fine adjustment and component rotation. The system is suitable for industrial and power electronics as well as large-format boards and is particularly attractive for service providers.

Rework Circuit Board Formats*

From S to M and L to XL.

*PCB format: length times width (each approx. max. limit): S = 300 x 250 mm; M = 390 x 285 (+x) mm; L = 535 x 300 mm; XL = 625 x 625 mm.

Rework System HR 550 XL - 1,800 W high-power heating element
Rework System HR 550 XL

Technical Highlights

  • 1,800 W high-performance hybrid heating element
  • Full-surface 6,400 W IR bottom heater
  • High-resolution cameras for placement and process monitoring
  • Computer-aided component alignment, digital split optics
  • Ergonomically optimal system operation
  • Modern, user-friendly operating software
[Translate to English:] Rework-System HR 550 XL - präzise Bauteilplatzierung
Rework Technology

Maintaining Added value!

The Technology of Ersa Rework Systems sustainably secures the added value of electronics:

  • gentle heating technology
  • sensor guided soldering processes
  • contactless residual solder removal
  • precise component placement
  • complete process documentation
  • clear user guidance

>> Learn more about Ersa Rework Technology

 

Specifications Rework System Ersa HR 550 XL
 

Technical data HR 550 XL

  • Dimensions (W x D x H) in mm: 755 x 930 x 545/747
  • Weight in kg: 102 kg including control unit
  • Antistatic Design (y/n): yes
  • Power Rating in W: 8.200
  • Nominal voltage in V AC: 3x 400 VAC, 50-60 Hz, 16 A
  • Upper heating: Hybrid radiator 900 W infrared + 900 W hot air, 70 x 70 mm
  • Lower heating: IR emitter (8x 800 W), 530 x 530 mm
  • Measuring channels: 3x K-type, 1 x IRS
  • Position laser: Class II
  • PCB size in mm: up to 530 x 610 mm (+x)
  • Component size in mm: from 01005 up to 70 x 70 mm
  • Working depth: 349 mm
  • Usable working distance (typ.): 30-60 mm to top heater, 35 mm to bottom heater
  • Placement camera, upper: 5 MP GigE colour camera, 70 x 70 mm (wide angle), 25 x 33 mm (telephoto)
  • Compressed air connection: 6-10 bar (oil-free), ¼ inch quick coupling
  • Volume of air cooling: approx. 65 l/min (@ 6 bar)
  • Test symbol: CE
  • Operating software: HRSoft 2 - suitable for Windows 8 and Windows 10
  • Option: Reflow process camera: 2,3 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable
  • Component rotation and x/y adjustment motorized, tip operation with resolution less than 20 µm
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